Call For Papers

Call for Papers

Track 1: Semiconductor Materials, Devices, and Process Integration
  • Advanced CMOS Logic Devices
  • Advanced Process Technologies
  • Advanced Interconnect Technologies
  • Power Devices Technologies
  • 2D Devices & Technologies
  • Thin Film Devices and Technologies
  • Compound Semiconductor Technologies
  • New Non-Volatile Memory Technologies
  • Flash & 3D Memory Technologies
  • Optoelectronics and Silicon Photonics
  • Sensor, MEMS, and Bioelectronics
  • Emerging Semiconductor Materials & Devices
  • 3D Integration
  • Advanced & Heterogeneous Packaging
Track 2: Device Reliability, Modeling, and Simulation
  • Logic and Power Device Reliability
  • Memory Device Reliability
  • Back-End of Line Reliability & ESD
  • Device Modeling & Simulation
  • Process Modeling & Simulation
  • Design & Technology Co-Optimization
  • Chip Test and Reliability

Track 3: Circuit Design and Signal Processing Technologies
  • Microwave, Millimeter Wave and Analog
  • Digital Module & Circuit
  • Analog Module & Circuit
  • Mixed-Signal Circuit & ADC/DACs
  • RF Module & Circuit
  • Memory Circuits
  • Efficient AI Circuit
  • Wireline and Optical Communication Circuit
  • FPGA Circuits
  • Advanced Clock
  • Signal Processing
  • EDA Technology for Circuit Design
Track 4: System Integration and Advanced Computing Applications
  • Device Technologies for New Computing System
  • SoC for IoT and Other Applications
  • Processor & Advanced Computing System
View Submission Guidlines