Welcome to IEEE ICSICT 2026
2026 IEEE 18th International Conference on Solid-State and Integrated Circuit Technology will be held on Oct. 27 - 30, 2026 in Hangzhou, China.

The ICSICT-2026 conference is the 18th in the series aiming to provide an international forum for the presentation and discussion of recent advances in solid-state and integrated circuit technology. The conference will be held on Oct. 27 - 30, 2026 in Hangzhou, China. All aspects of solid-state devices, circuits and systems, process technologies, materials and other related research are within the scope of the conference. Over the course of four days, a rich program of contributed and invited presentations will cover the latest advancements in various fields. These presentations will be delivered through both oral and poster sessions, accompanied by panel discussions addressing cutting-edge technology issues and various engaging activities. This comprehensive program aims to foster extensive opportunities for the exchange of technical information and create a stimulating atmosphere for mutual communication among all participants. The presentation of the Excellent Student Paper Award and the Outstanding Young Scholar Paper Award will take place during the conference's closing ceremony. Enterprises with relevance to the event are encouraged to join and actively take part in the exhibition.

Download CFP

Scope

Call for Papers

(Papers are solicited in, but not limited to the following areas)

Track 1: Semiconductor Materials, Devices, and Process Integration
  • Advanced CMOS Logic Devices
  • Advanced Process Technologies
  • Advanced Interconnect Technologies
  • Power Devices Technologies
  • 2D Devices & Technologies
  • Thin Film Devices and Technologies
  • Compound Semiconductor Technologies
  • New Non-Volatile Memory Technologies
  • Flash & 3D Memory Technologies
  • Optoelectronics and Silicon Photonics
  • Sensor, MEMS, and Bioelectronics
  • Emerging Semiconductor Materials & Devices
  • 3D Integration
  • Advanced & Heterogeneous Packaging
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Track 2: Device Reliability, Modeling, and Simulation
  • Logic and Power Device Reliability
  • Memory Device Reliability
  • Back-End of Line Reliability & ESD
  • Device Modeling & Simulation
  • Process Modeling & Simulation
  • Design & Technology Co-Optimization
  • Chip Test and Reliability
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Track 3: Circuit Design and Signal Processing Technologies
  • Microwave, Millimeter Wave and Analog
  • Digital Module & Circuit
  • Analog Module & Circuit
  • Mixed-Signal Circuit & ADC/DACs
  • RF Module & Circuit
  • Memory Circuits
  • Efficient AI Circuit
  • Wireline and Optical Communication Circuit
  • FPGA Circuits
  • Advanced Clock
  • Signal Processing
  • EDA Technology for Circuit Design
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Track 4: System Integration and Advanced Computing Applications
  • Device Technologies for New Computing System
  • SoC for IoT and Other Applications
  • Processor & Advanced Computing System
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Important Dates

  • May 25, 2026 Submission Deadline
  • June 25, 2026 Notificaiton Deadline
  • July 25, 2026 Camera-ready Due

Paper Submission Guidelines

Prospective authors are requested to submit 3 pages camera-ready full length paper in English for proceedings publication. Accepted papers will be submitted for inclusion into IEEE Xplore subject to meeting IEEE Xplore's scope and quality requirements and can be retrieved by EI.

Paper Submission link: To be updated.


ICSICT Paper Template

Latest News

Submission System Opened

The submission system for ICSICT 2026 has been opened. Welcome to submit papers through: xxxxxx

October 10, 2025

ICSICT 2026

ICSICT 2026 will be held on Oct. 27 - 30, 2026 in Hangzhou, China. Welome to attend the conference.

September 20, 2025

Organizer & Sponsors

Sponsored By

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Co-sponsored By

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Contact Us

Conference Secretary: Joyce

Tel.: +86-18628263876

Email: icsict2025@csj.uestc.edu.cn