Conference Scope: The following are the technical tracks and research directions of ICSICT 2026 (paper submissions are solicited in, but not limited to the following areas)
Theme 1: Process & Technologies
Track 1:Semiconductor Process Technologies
- Compound Semiconductor Materials & Technologies
- Advanced Memory Materials & Technologies
- Advanced Process Technologies
- Advanced Interconnect Technologies
- Process Modeling & Simulation
Track 2:Optoelectronics and Silicon Photonics Integration
- High-Speed Optoelectronic Devices
- Silicon Photonics & Integration
- Photonic Sensors & Image Sensors
- Optical Computing Devices
- Display Process & Integration
Track 3:Packaging Technologies
- 2.5D & 3D Integration
- Heterogeneous Integration Packaging
- Advanced Wire Bonding Technology
- Modeling and Simulation for Advanced Packaging
- Testing and Reliability in Advanced Packaging
Theme 2: Devices
Track 4:CMOS Logic Devices & Sensors
- Advanced CMOS Logic Devices
- 2D & Thin Film Devices & Technologies
- Flash & Non-Volatile & 3D Memory Technologies
- Sensor, Sensing Microsystem, MEMS, and Bioelectronics
- Smart/Intelligent Sensors & Actuators
- Device Modeling & Simulation
Track 5:Power Devices & Power IC
- Silicon-based Power Devices
- Wide Bandgap Power Devices
- Power Integrated Circuits、modules & Systems
- Power Integrating & Packaging Technology
- Power Device Reliability
- Power Device Modeling & Simulation
Track 6:Device Reliability & Security
- Back-End of Line Reliability & ESD
- Aging & Remaining Useful Lifetime Prediction
- PUF & Hardware Security
- Devices Radiation Reliability
Theme 3: Analog
Track 7:RF & Wireless
- Building Blocks at RF, mm-wave and THz
- Rx, Tx or TRx for Wireless Systems
- Wireless Sensor, Radar, Imager
- Device/Packaging/Modeling at RF, mm-wave and THz
Track 8:Wireline
- Electrical/Optical Transmitters/Receivers for Wireline
- Clock Generation and Distribution Circuits
- Building Blocks for High-Speed Wireline Communications
Track 9:General Analog
- Advanced Analog Circuits
- High-Speed, High-Precision Data Converters
- Imagers, Medical Devices & Display Systems
- Efficient Power Management Circuits
Theme 4: Digital IC & System Level Design
Track 10:Digital Integrated Circuits & Systems
- Digital Blocks & Circuits
- Digital Signal Processing Integrated Circuits & Systems
- FPGA Circuits Design & Application
- Processors, Accelerators & SoCs
- Advanced Computing Integrated Circuits & Systems
Track 11:Memories
- Non-volatile Memory
- SRAM & DRAM
- 3D Memory Technologies
- Processing-in-Memory Techniques
- Memory Testability & Reliability
Track 12:Design Methodology & EDA Technology
- Design for Testability, Reliability & Manufacturability
- Modeling, Simulation & Emulation
- Design & Technology Co-Optimization
- High Level Synthesis & Design Automation
- Artificial Intelligence Algorithms for EDA