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Track Chairs

Digital & System Level IC Subcommittee

Chair: Yuchao Yang, Peking University, China
Co-Chair: Hailong Jiao, Peking University, China
Track 1：Digital Architectures & Systems
Chair: Zhiyi Yu Sun Yat-sen University, China
Co-Chairs: Yaoyu Tao Peking University, China Hongyang Jia Tsinghua University, China
Track 2：Digital Circuits
Chair: Yongpan Liu Tsinghua University, China
Co-Chairs: Yanan Sun Shanghai Jiao Tong University, China Fengbin Tu Hong Kong University of Science and Technology, China
Track 3：Design Methodology & EDA
Chair: Jun Yang Southeast University, China
Co-Chairs: Yibo Lin Peking University, China Yu Li Zhejiang University, China

Analog Subcommittee

Chair: Jing Jin, Shanghai Jiao Tong University, China
Co-Chair: Zheng Wang, University of Electronic Science and Technology of China, China
Track 4: RF & Wireless
Chair: Keping Wang Tianjin University, China
Co-Chairs: Jian Pang Shanghai Jiao Tong University, China Kai Tang Hunan University, China
Track 5: Wireline
Chair: Xiaoyan Gui Xi'an Jiaotong University, China
Co-Chairs: Bingyi Ye East China Normal University, China Yuekang Guo Shanghai Jiao Tong University, China
Track 6: General Analog
Chair: Lin Cheng University of Science and Technology of China, China
Co-Chairs: Junmin Jiang Southern University of Science and Technology, China Ang Hu Huazhong University of Science and Technology, China

Devices Subcommittee

Chair: Wentong Zhang, University of Electronic Science and Technology of China, China
Co-Chair: Jin Wei, Peking University, China
Track 7：CMOS Logic Devices & Sensors
Chair: Heng Wu Peking University, China
Co-Chairs: Wang Kang Beihang University, China Xiaosheng Zhang University of Electronic Science and Technology of China, China
Track 8：Power Devices & Power IC
Chair: Long Zhang Southeast University, China
Co-Chairs: Jiafei Yao Nanjing University of Posts and Telecommunications, China Zekun Zhou University of Electronic Science and Technology of China, China
Track 9：Device Reliability & Security
Chair: Mengyuan Hua Southern University of Science and Technology, China
Co-Chairs: Sen Huang Institute of Microelectronics of Chinese Academy of Sciences, China Zhao Qi University of Electronic Science and Technology of China, China

Process & Technologies Subcommittee

Chair: Haifeng Ling, Nanjing University of Posts and Telecommunications, China
Co-Chair: Zhihao Yu, Nanjing University of Posts and Telecommunications, China
Track 10：Semiconductor Process Technologies
Chair: Bobo Tian East China Normal University, China
Co-Chairs: Min Liao Xidian University, China Li Zhu Nanjing University of Posts and Telecommunications, China
Track 11：Optoelectronics and Silicon Photonics Integration
Chairs: Linfeng Sun Beijing Institute of Technology, China Ming Xu Huazhong University of Science and Technology, China Yuanfang Yu Nanjing University of Posts and Telecommunications, China
Track 12：Packaging Technologies
Chair: Jun Zhang Nanjing University of Posts and Telecommunications, China
Co-Chairs: Shenyang Mo NARI Semiconductor R&D Center, China Pengfei Zhao Nanjing University of Posts and Telecommunications, China

Contact

Conference Secretary: Ms. Joyce, Email: ieeeicsict@outlook.com

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