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Technical Program Committee

Technical Program Committee Chairs

Haruo Kobayashi, Gunma University, Japan
Ming Li, Peking University, China
Bo Zhang, University of Electronic Science and Technology of China, China
Yi Zhao, Huada Semiconductor, China

Technical Program Committee Co-Chairs

Bei Yu, The Chinese University of Hong Kong, China
Zheng Wang, University of Electronic Science and Technology of China, China
Fakhrul Zaman Rokhani, Universiti Putra Malaysia, Malaysia
Ling Zhang, Zhejiang University, China
Yuchao Yang, Peking University, China
Jing Jin, Shanghai Jiao Tong University, China
Wentong Zhang, University of Electronic Science and Technology of China, China
Haifeng Ling, Nanjing University of Posts and Telecommunications, China

Digital & System Level IC Subcommittee

Chair: Yuchao Yang, Peking University, China
Co-Chair: Hailong Jiao, Peking University, China
Track 1：Digital Architectures & Systems
Chair: Zhiyi Yu Sun Yat-sen University, China
Co-Chairs: Yaoyu Tao Peking University, China Hongyang Jia Tsinghua University, China
Track 2：Digital Circuits
Chair: Yongpan Liu Tsinghua University, China
Co-Chairs: Yanan Sun Shanghai Jiao Tong University, China Fengbin Tu Hong Kong University of Science and Technology, China
Track 3：Design Methodology & EDA
Chair: Jun Yang Southeast University, China
Co-Chairs: Yibo Lin Peking University, China Yu Li Zhejiang University, China

Analog Subcommittee

Chair: Jing Jin, Shanghai Jiao Tong University, China
Co-Chair: Zheng Wang, University of Electronic Science and Technology of China, China
Track 4: RF & Wireless
Chair: Keping Wang Tianjin University, China
Co-Chairs: Jian Pang Shanghai Jiao Tong University, China Kai Tang Hunan University, China
Track 5: Wireline
Chair: Xiaoyan Gui Xi'an Jiaotong University, China
Co-Chairs: Bingyi Ye East China Normal University, China Yuekang Guo Shanghai Jiao Tong University, China
Track 6: General Analog
Chair: Lin Cheng University of Science and Technology of China, China
Co-Chairs: Junmin Jiang Southern University of Science and Technology, China Ang Hu Huazhong University of Science and Technology, China

Devices Subcommittee

Chair: Wentong Zhang, University of Electronic Science and Technology of China, China
Co-Chair: Jin Wei, Peking University, China
Track 7：CMOS Logic Devices & Sensors
Chair: Heng Wu Peking University, China
Co-Chairs: Wang Kang Beihang University, China Xiaosheng Zhang University of Electronic Science and Technology of China, China
Track 8：Power Devices & Power IC
Chair: Long Zhang Southeast University, China
Co-Chairs: Jiafei Yao Nanjing University of Posts and Telecommunications, China Zekun Zhou University of Electronic Science and Technology of China, China
Track 9：Device Reliability & Security
Chair: Mengyuan Hua Southern University of Science and Technology, China
Co-Chairs: Sen Huang Institute of Microelectronics of Chinese Academy of Sciences, China Zhao Qi University of Electronic Science and Technology of China, China

Process & Technologies Subcommittee

Chair: Haifeng Ling, Nanjing University of Posts and Telecommunications, China
Co-Chair: Zhihao Yu, Nanjing University of Posts and Telecommunications, China
Track 10：Semiconductor Process Technologies
Chair: Bobo Tian East China Normal University, China
Co-Chairs: Min Liao Xidian University, China Li Zhu Nanjing University of Posts and Telecommunications, China
Track 11：Optoelectronics and Silicon Photonics Integration
Chairs: Linfeng Sun Beijing Institute of Technology, China Ming Xu Huazhong University of Science and Technology, China Yuanfang Yu Jiangnan University, China
Track 12：Packaging Technologies
Chair: Jun Zhang Nanjing University of Posts and Telecommunications, China
Co-Chairs: Shenyang Mo NARI Semiconductor R&D Center, China Pengfei Zhao Nanjing University of Posts and Telecommunications, China

Technical Program Committee Members

Lang Zeng, Beihang University, China
Xuefei Li, Huazhong University of Science and Technology, China
Xiaolei Wang, Institute of Microelectronics, Chinese Academy of Sciences, China
Wangran Wu, Southeast University, China
Pengpeng Ren, Shanghai Jiao Tong University, China
Xin Sun, NAURA Microelectronics, China
Zongwei Wang, Peking University, China
Dunbao Ruan, Fuzhou University, China
Huiyun Li, Shenzhen University of Advanced Technology, China
Ruiguang Zhao, Northwestern Polytechnical University, China
Ziyue Zhang, Beijing Institute of Technology, China
Zhizhan Yang, Southwest Jiaotong University, China
Tao Su, Sun Yat-Sen University, China
Zhiguo Yu, Jiangnan University, China
Xiaoying Deng, Shenzhen University, China
Deming Zhang, Beihang University, China
Maliang Liu, Xidian University, China
Aili Wang, Zhejiang University, China
Yishu Zhang, Zhejiang University, China
Wan'ang Xiao, Institute of Semiconductors, Chinese Academy of Sciences, China
Meilin Wan, Hubei University, China
Xuan Guo, Institute of Microelectronics of the Chinese Academy of Sciences, China
Yueting Li, Beihang University, China
Ke Chen, Nanjing University of Aeronautics and Astronautics, China
Pei-Yu Lee, Synopsys, China
Pingqiang Zhou, ShanghaiTech University, China
Jie Han, University of Alberta, Canada
Yi Zou, South China University of Technology, China
SangHoon Shin, Hanyang University, South Korea
Chang Niu, National University of Singapore, Singapore
He Zhang, Beijing University of Aeronautics and Astronautics, China
Zhengdong Luo, Xidian University, China
Bi Wu, Nanjing University of Aeronautics and Astronautics, China
Cheng Tu, University of Electronic Science and Technology of China, China
Weipeng Xuan, Hangzhou Dianzi University, China
Pengcheng Jiao, Zhejiang University, China
Feng Zhou, Nanjing University, China
Jiaxing Wei, Southeast University, China
Meng Zhang, Beijing University of Technology, China
Feng Lin, Hangzhou Silan Microelectronics Co., Ltd.
Kui Xiao, CSMC Technologies Corporation, China
Wei Lin, SiEn (Qingdao) Integrated Circuits Co., Ltd., China
Pengyu Lai, Southeast University, China
Yuxiang Chen, University of Arkansas, United States
Xiaoli Tian, Institute of Microelectronics of the Chinese Academy of Sciences, China
Hengyu Wang, Zhejiang University, China
Wen Liu, Xi'an Jiaotong-Liverpool University, China
Xiaochuan Deng, University of Electronic Science and Technology of China, China
Hongbo Ma, Southwest Jiaotong University, China
Min Gong, Sichuan University, China
Yongqiang Cai, Beijing Normal University, China
Man Hoi WANG, The Hong Kong University of Science and Technology, Hong Kong, China
Weijia Zhang, The Hong Kong University of Science and Technology, Hong Kong, China
Yi Zhang, The Hong Kong Polytechnic University, Hong Kong, China
Zihui Zhang, Guangdong University of Technology, China
Ziyuan Liu, Shanghai Institute of IC Materials, China
Yamin Zhang, Beijing University of Technology, China
Xufang Zhang, North China University of Technology, China
Ronghua Wang, Rivotek, China
Chunhua Zhou, Pinghu Laboratory, China
Guanhua Yang, Institute of Microelectronics of the Chinese Academy of Sciences, China
Guangwei Xu, University of Science and Technology of China, China
Chao Liu, Shandong University, China
Xinbo Zou, ShanghaiTech University, China
Xi Tang, Anhui University, China
Longfei Liang, Hangzhou Silan Microelectronics Co., Ltd., China
Wei-Han Yu, University of Macau, Macau, China

Contact

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